CPU Vapor Chamber Heat Sink
This CPU vapor chamber heat sink is composed of vapor chamber and aluminum stamped fins which are applied to Intel processor heat dissipation.
Assembled High Power Liquid Cold Plate
Assembled High Power Liquid Cold Plate is used for Industry Automation, Power & Drive, Energy System, E-mobility, Medical System, Instrument & Test Equipment etc.
Heat Pipe Assemblies with Aluminum Extrusion Heat Sinks
All of PT HEATSINK's custom heat pipe assembly heatsinks are designed and manufactured to meet the specific application requirements of our diverse customer base. Furthermore, PT HEATSINK's Custom Heat Pipe Assembly solutions allow engineers greater flexibility in designing of heat sink size, geometry, weight, and/or layout of their system components, all without sacrificing system performance.
Black Anodizing Aluminum Extrusion Heatsink
Black Anodizing Aluminum Extrusion Heatsink for Communication Equipments
Aluminum Extrusion with Cu Base and HP Heatsink
Aluminum Extrusion with Cu Base and HP Heatsink for Communications Equipments
AL Extrusion CU Stacked Fin Heat Pipe Heatsink
AL Extrusion CU Stacked Fin Heat Pipe Heatsink for Communication Equipment
Copper Stacked Fin Heat Pipe Heatsink
Copper Stacked Fin Heat Pipe Heatsink for communication equipment
Vapor Chamber Heatsink
Vapor Chambers which work based on heat pipe principles, offer improved spreading efficiency, higher thermal conductivity, and reduced weight for CPUs, GPUS, and high performance ASICs.
Brazed Fin Heat Sinks
Brazed fin heat sinks are assembly of a grooved base with individual fins bonded into the grooves. This type of heat sink fabrication allows for higher fin densities and fin aspect ratios than what is manufacturable with extrusion method, greatly improving thermal performance compared to extruded heat sinks due to increased surface area.
PT Heatsink Technology Co., Ltd
Tel: +86 137 1131 9878
Fax: +86 769 87689566 607
Add: Xiegang Village, Xiegang Town, Dongguan City, Guangdong Province, 523596, China